http://code.google.com/p/homecmos/wiki/WetEtchRecipes
Unless otherwise specified, chemical concentrations are as follows:
- Acetone: concentrated
- H2O2: 3% solution in water
- HCl: 37% solution in water
- HF: 3% solution in water
- NaOH: 1% solution in water
- KOH: 30% solution in water
metals
Aluminum (evaporated)
Copper etches should work but etch rates will be slightly different
Chromium (evaporated)
Copper etches should work but etch rates will be slightly different
Other materials
| Material | Etch | Suggested masks | Temperature | Approximate etch rate |
|---|---|---|---|---|
| Copper (evaporated) | 1 HCl : 6 H2O2 | photoresist | room temperature | 3500-4000 nm/min |
| Copper (evaporated) | 1 HCl : 5 H2O2 : 50 H2O | photoresist | room temperature | 350-400 nm/min |
| Silicon (\<100\> plane) | KOH | thermal SiO2 (slowly attacked), Ta2O5 (deep etches) | 80C | TODO |
| Silicon (\<110\> plane) | KOH | thermal SiO2 (slowly attacked), Ta2O5 (deep etches) | 80C | TODO |
| Silicon dioxide (thermal) | 1 HF : 5 H2O | photoresist | room temperature | TODO |
| Silicon dioxide (sol-gel) | 1 HF : 5 H2O | photoresist | room temperature | 1200 - 1800 nm/min |
| Tantalum oxide (sol-gel) | HF | Cu with Cr adhesion layer | 80C | 5-20 nm/min (rough number) |
missing
- silicon (isotropic)