From: Entropyfoe@aol.com
Date: Fri Nov 06 1998 - 20:39:42 MST
One flaw in the spherical semiconductors. Certian devices are made on the
<100> surface of Si, and others on the <111> surface. When oxidized, the 111
surface has higher surface charged defect density, making it less suitable for
good MOS circuits.
By definition shpere must have multiple crystal orientations on it's surface.
A real fundamental practical problem. I like Dan's stuff on the cheap, slabs-
o-plastic chip approach. We need a good science fiction story to explore the
implications of this !
There is (or was) the multichip module approach (MCM). Bare (no plastic or
ceramic chip package) die are bonded to a very high density interconnect. The
MCM was made with the same technology as chips a few generations back with
thick copper lines of the 10-20 micrometer width range. The market did not
really take off and only a few companies are left in it. Micro Module Systems,
a spin off from DEC is still credible.
-Jay
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