From: Doug Jones (djones@xcor.com)
Date: Fri Feb 15 2002 - 11:09:38 MST
Mike Lorrey wrote:
>
> "Robert J. Bradbury" wrote:
> >
> > Michael Butler wrote:
> > > It seems that one must deal with the notion that self-replicating general
> > > purpose assemblers is Drexler's sole contribution/albatross;
> >
> > I don't consider that to be the case. If one reads Nanosystems
> > and Eric's other papers carefully there are a huge number of
> > other things discussed. A few would include -- snip..
> > the fact that heat removal is the *real*
> > problem for high computation densities,
>
> I'm wondering why chip companies are not looking at building MEMS
> cooling systems into chips, and why they are not already designing
> cooling ports into the chips. A number of evenly spaced venturi ports
> across the chip face for the fan to draw air through should provide a
> significant increase in cooling. As chip designs get thicker, this will
> be a very necessary design feature.
There's an outfit in Los Alamitos (yet another LA suburb) that builds
copper etched-film laminate devices, mostly for active cooling of laser
diodes. They built a combustion chamber for RotRock which I supervised
the testing of at 3000 lb thrust... I haven't heard any proposals for
making labyrinth cooling in silicon- if feasible it might be a good
improvement, and cheaper than attaching a separate copper heat
exchanger. Liquid coolant would be superior to air, partly due to
better heat exchange, partly because the coolant could be kept cleaner
than air.
See http://www.saddle-aero.com/ for details.
-- Doug Jones, Rocket Plumber XCOR Aerospace
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